SilTerra Multi-Project Wafer Enquiry Form 
*
Please Fill In All The Fields.
Company :
Telephone :
Address :
Company URL :
Contact Person :
Region :
China/HK
EU
Japan
Korea
Other
Taiwan
US
Email :
Project Name :
Expected Tape Out Date :
Technology Geometry :
110nm
130nm
150nm
160nm
180nm
Required IP :
Technology Type :
BCD
HV
IOT
Logic
RFCMOS
Number of Metal Layers :
Expected Die Size :
x
mm y
mm
Attachments :
Note : SilTerra Sales personnel will contact you shortly upon form submission